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SI-8008HD DC-to-DC Step-Down Converter
Features and Benefits
5.5 A output current supplied in a small, surface mount power package High efficiency: 83% at VIN = 15 V, IO = 3.0 A,VO = 5 V Requires only seven external components (optional soft start requires an additional capacitor) Oscillation circuit built-in (frequency 150 kHz typical) Constant-current mode overcurrent protection circuit and overtemperature protection circuit built-in Soft start function built-in (can be implemented as an on/off function; output-off state at low level) Low current consumption during output-off state
Description
The SI-8008HD DC voltage regulator is a DC-to-DC buck convertor that attains an oscillation frequency of 150 kHz, and has an integrated miniaturized choke coil, allowing it to serve as a small, high efficiency power supply in a compact TO-263 package. The internal switching regulator function provides high efficiency switching regulation without any need for adjustment. The device requires only six external support components. The optional soft start function requires an additional capacitor. Optional on/off control can be performed using a transistor. The SI-8008HD includes overcurrent and overtemperature protection circuits. Applications include: DVD recorder FPD TV Telecommunications equipment Office automation equipment, such as printers On-board local power supply Output voltage regulator for second stage of SMPS (switched mode power supply)
Package: TO263-5
Not to scale
Functional Block Diagram
VIN 1 IN PReg Overcurrent Protection Latch and Driver SW 2 L1 Di FMB-G16L (Sanken) VOU C2
C1
C4
Reset 5 SS On/Off Soft Start Osc Comparator
R1
C3
Overtemperature Protection Error Amplifier
ADJ
4
R2 Reference Voltage
GND 3
27469.059
SI-8008HD
DC-to-DC Step-Down Converter
Selection Guide
Part Number SI-8008HD-TL Output Voltage Adjustable Range (V) 0.8 to 24 Efficiency, Typ. (%) 83 Input Voltage, Max. (V) 40 Output Current, Max. (A) 5.5 Packing 800 pieces per reel
Absolute Maximum Ratings
Characteristic DC Input Voltage Power Dissipation Junction Temperature Storage Temperature Thermal Resistance (junction-to-case) Thermal Resistance (junction-to-ambient air) Symbol VIN PD TJ Tstg RJC RJA Mounted on 40 mm x 40 mm exposed copper area on 40 mm x 40 mm glass-epoxy PCB. Mounted on 40 mm x 40 mm exposed copper area on 40 mm x 40 mm glass-epoxy PCB. Mounted on 40 mm x 40 mm exposed copper area on 40 mm x 40 mm glass-epoxy PCB; limited by internal overtemperature protection. Internal overtemperature protection circuit may enable when TJ 130C. During product operation, recommended TJ 125C. Remarks Rating 43 3 -40 to 150 -40 to 150 3 33.3 Units V W C C C/W C/W
Recommended Operating Conditions*
Characteristic DC Input Voltage Range DC Output Voltage Range DC Output Current Range Operating Junction Temperature Range Operating Temperature Range Symbol VIN VO IO TJOP TOP To be used within the allowable package power dissipation characteristics (refer to Power Dissipation chart). VIN VO + 3 V; to be used within the allowable package power dissipation characteristics (refer to Power Dissipation chart). Remarks VIN (min) is the greater of 4.5 V or VO+3 V. Min. See remarks 0.8 0 -30 -30 Max. 40 24 3.5 100 85 Units V V A C C
*Required for normal device functioning according to Electrical Characteristics table.
All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25C, unless otherwise stated.
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
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SI-8008HD
DC-to-DC Step-Down Converter
ELECTRICAL CHARACTERISTICS1, valid at TA = 25C, VO = 5 V (adjusted), R1 = 4.2 k, R1 = 0.8 k
Characteristic Reference Voltage Reference Voltage Temperature Coefficient Efficiency2 Operating Frequency Line Regulation Load Regulation Overcurrent Protection Threshold Current SS Terminal On/Off Operation Threshold Voltage SS Terminal On/Off Operation Outflow Current Quiescent Current 1 Quiescent Current 2
1Using
Symbol VADJ VADJ /T fO VLine VLoad IS VSSL ISSL Iq Iq(off) VSSL = 0 V
Test Conditions VIN = 15 V, IO = 0.2 A VIN = 15 V, IO = 0.2 A, TC = 0 to 100 C VIN = 15 V, IO = 3 A VIN = 15 V, IO = 3 A VIN = 10 to 30 V, IO = 3 A VIN = 15 V, IO = 0.2 to 5.5 A VIN = 15 V
Min. 0.784 - - - - - 5.6 - - - -
Typ. 0.800 0.1 83 150 60 20 6.5 - 10 6 200
Max. 0.816 - - - 80 50 7.5 0.5 30 - 400
Units V mV/C % kHz mV mV A V A mA A
VIN = 15 V, IO = 0 A VIN = 15 V, VSS = 0 V
circuit shown in Typical Application Circuit diagram. 2Efficiency is calculated as: (%) = ([V x I ] x [V x I ]) x 100. O O IN IN
Pin-out Diagram
Terminal List Table
Name IN SW GND ADJ Number 1 2 3 4 Supply voltage Regulated supply output Ground terminal Terminal for resistor bridge feedback The SS terminal is used to enable soft start and to control on/off operation of the IC output, VO (see figure 2). If neither soft start nor on/off control is used, leave pin open. To enable soft start, connect a capacitor between SS and ground. To control on/off operation, connect an NPN bipolar transistor, in a TTL open collector output configuration, between the SS terminal and GND. Turn off is done by decreasing VSSL below its rated level. When both soft start and VO on/off are used, a protection measure such as current limiting is required because, if the capacitance of C3 large, the discharge current of C3 flows across the transistor for on/off operation. Because a pull-up type resistor is provided inside the IC, no external voltage can be applied. Function
SS
5
1
2
3
4
5
SI-8008HD
SS 5
SI-8008HD
SS 5
SI-8008HD
SS 5
System TTL
C3
System TTL
C3
(a) VO on/off control only
(b) Soft start only
(c) VO on/off and soft start control
Figure 2. Alternative configurations for SS pin. If neither soft start nor VO on/off is required, the SS pin is left open.
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
3
SI-8008HD
DC-to-DC Step-Down Converter
Performance Characteristics
at TA = 25C, VO = 5 V adjusted, , R1 = 4.2 k, R2 = 0.8 k
90
8V
15 V
5.06 5.04
VIN 40 V
80
30 V
(%)
5.02
40 V
60
VIN
VO (V)
Efficiency versus Output Current
70
Load Regulation: 5.00 Output Voltage versus 4.98 Output Current
4.96
30 V 20 V 10 V
50
8V
4.94 4.92
40
0
1
2
3
4
5
6
0
1
2
IO (A) 6.00
0A
3 IO (A)
4
5
6
6
1A 2A
5.00
5
3A 4A 5.5 A 8V
Low Voltage Behavior: Output Voltage versus Supply Voltage
4.00 VO (V) 3.00 2.00
Overcurrent Protection: Output Voltage versus Output Current
IO
4
VO (V)
VIN
3 2 1 0
10 V 15 V 20 V 30 V 40 V
1.00 0
0
1
2
3
4 5 VIN (V)
6
7
8
0
2
4 IO (A)
6
8
6
OTP On
5
Overtemperature Protection: Output Voltage versus Junction Temperature
VIN = 15 V, IO = 10 mA
4 VO (V) 3 2 1
OTP Off
0 0 20 40 60 80 100 TJ (C) 120 140 160 180
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
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SI-8008HD
DC-to-DC Step-Down Converter
Thermal Performance Characteristics
The application must be designed to ensure that the TJ(max) of the device is not exceeded during operation. To do so, it is necessary to determine values for maximum power dissipation, PD(max), and ambient temperature, TA(max). The relationships of TJ, PD, TA, and case temperature, TC, are as shown in the following formulas: PD = TJ - TC RJC
Power Dissipation versus Ambient Temperature
TJ(max) = 125C; Mounted on glass-epoxy PCB (40 mm x 40 mm), with varying exposed copper areas
3.5
Cu Area: 1600 mm2 RJA = 33.3C/W
3.0
Cu Area: 800 mm2 RJA = 37C/W
and
PD =
TJ - TA RJA
.
2.5
PD can be calculated from input values:
100 V - 1 - VF I O 1 - O PD = VO I O V IN x
where: VO is output voltage in V, VIN is input supply voltage in V, IO is output current in A,

2.0 PD (W)
Cu Area: 400 mm2 RJA = 44C/W
1.5
Cu Area: 100 mm2 RJA = 53C/W
1.0
x is IC efficiency in percent (varies with VIN and IO; refer to efficiency performance curves for value), and VF is forward voltage for the input diode, Di. In these tests, the Sanken FMB-G16L was used, at 0.55 V. For application design, obtain thermal data from the datasheet for the diode. PD is substantially affected by the heat conductance properties of the application, in particular any exposed copper area on the PCB where the device is mounted. The relationships of PD, TA, and copper area is represented in the Power Dissipation chart. RJA for a given copper area can be determined form the Device Thermal Resistance chart. This can be substituted into the formula above to determine the TJ (max) allowable in the application. Generally, more than 10% to 20% derating is required. Because the heat dissipation capacity of the copper area depends substantively on how it is used in the actual application, thermal characteristics of the application must be confirmed by testing. TC is determined by connecting a thermocouple to the device as shown here:
0.5
0 -25 0 25 50 TA (C) 75 100 125
Device Thermal Resistance versus Exposed Copper Area on PCB
55
RJA(C/W) Glass-epoxy PCB, 40 mm x 40 mm
50 45 40 35 30
0 200 400 600 800 1000 1200 1400 1600 1800
Copper Area (mm2)
Power Dissipation versus Output Current
10 9 8 7 6 5 4 3 2 1 0
VIN (V)
Thermocouple mount at tab center
8 15 20 40
And analyzing the results using the following formula: TJ = PD x RJC + TC , for this device, RJC is 3 C/W.
PD(W)
0
1
2
3
4
5
6
IO(A)
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
5
SI-8008HD
DC-to-DC Step-Down Converter
Component Selection
Diode Di A Schottky-barrier diode must be used for Di. If other diode types are used, such as fast recovery diodes, the IC may be destroyed because of the reverse voltage applied by the recovery voltage or ON voltage. Choke Coil L1 If the winding resistance of the choke coil is too high, the efficiency may be reduced below rating. Because the overcurrent protection start current is approximately 6.5 A, attention must be paid to the heating of the choke coil by magnetic saturation due to overload or short-circuited load. Capacitors C1, C2, C3, and C4 Because for SMPS, large ripple currents flow across C1 and C2, capacitors with high frequency and low impedance must be used. If the impedance of C2 is too high, the switching waveform may not be normal at low temperatures. Do not use either OS or tantalum types of capaci-
tors for C2, because those cause an abnormal oscillation. The device is stabilized, and for proper operation, C1 and C4 must be located close to the device (see layout diagram, below). C3 is required only if the soft start function is used. If not using soft-start, leave the SS terminal open. A pull-up resistor is provided inside the IC. Resistor Bridge R1 and R2 comprise the resistor bridge for the output voltage, VO, and are calculated as follows: (V - V ) (V - 0.8) () , and R2 = VADJ = 0.8 = 0.8 (k ) R1 = O ADJ = O -3 -3
IADJ 1 x 10 IADJ 1 x 10
IADJ should always be set to 1 mA. Note that R2 should always be present to ensure stable operation, even if VO, is set to 0.8 V (that is, even if there is no R1). VO should be at least VIN + 8%.
Typical Application Diagram
L1 VO
VIN
1 IN SI-8008HD SS GND 3 5 ADJ SW
2
Component C1 C2 C3 C4 Di L1
Rating 1500 F 1000 F 0.1 F (For soft start function) 4.7 F (GRM32ER71H475KA88L) FMB-G16L (Sanken) 100 H
4 Di
R1 IADJ R2 C2 GND
C1 GND
C4
C3 Soft Start Only
Recommended PCB Layout
Recommended Solder Pad Layout
110.2
90.2
6.80.1
90.1 3.70.05
40.1 10.05
All external components should be mounted as close as possible to the SI-8008HD. The ground of all components should be connected at one point near GND pin (pin 3).
1.70.1 (mm)
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
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SI-8008HD
DC-to-DC Step-Down Converter
PACKAGE OUTLINE DRAWING
2.20 0.20 9.90 0.20 (0.75) (0.40) + (6.80) (R0.45) 4.50 0.20 3XR0.30
15
(8.00) (4.40)
1.30 -0.05
+0.10
(4.60)
O1.5 0.20
XXXXXXXX
XXXXXXXX XXXXXXXX
3
+
15.30 0.30
Branding
XXXXXXXX
9.20 0.20
3XR0.30 0.10 0.15
2.00 0.10
3
(0.75)
0.88 0.10 0.80 0.10
4.90 0.20
3
2.40 0.20
(R0.30) (0.50)
6 0
4xP1.70 0.25
3
2XR0.30
1
2
3 4 10.00 0.02
5
Branding codes (exact appearance at manufacturer discretion): 1st line: SK 2nd line, lot: YMW X Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) W is the week of the month (1 to 5) X is the device subtype suffix number 3rd line, type: 8008HD
Dimensions do not include mold protrusion Heastsink side flash: 0.8 mm maximum Dimensions in millimeters
RoHS directive compliant Device pins lead (Pb) free
2.54 0.30
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
7
SI-8008HD
DC-to-DC Step-Down Converter
TAPE AND REEL SPECIFICATION
O1.5
+0.1 -0.0
2.0 0.10 B
1.75 0.10
4.0 0.10
0.4 0.05
11.5 0.05
24.3 0.03
A
A 16.0 10.6 B
O1.5 MIN 3.9 4.9
View A-A
15.7 View B-B
Material: Conductive polysterene Camber < 1 mm over of tape Camber < 1 mm over 100 mm length100 length of tape Pocket inner widths measured 0.3 of cavity Pocket inner widths measured 0.3 mm above floormm above floor of pocket
Material: conductive polysterene
Pocket position relative to sprocket hole measured to true position of pocket 10 sprocket hole pitch cumulative 0.2 mm Pocket center and pocket hole center 0.3 mm Surface resistivity < 107 / cm2
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
8
SI-8008HD
DC-to-DC Step-Down Converter
PACKING SPECIFICATION
Inner Carton 800 pieces per reel 2 reels per carton
341 65
344
Outer Carton 3 inner cartons per outer carton
450 230
Dimensions in mm
350
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
9
SI-8008HD
DC-to-DC Step-Down Converter
WARNING -- These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding.
Cautions for Use * Operation of the product in parallel to increase current is not permitted. * Although the product has an internal overtemperature protection circuit, that is intended only to protect the product from temporary excess heating due to overloads. Long-term reliability cannot be guaranteed when the product is operated under continuous overload conditions. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage * Ensure that storage conditions comply with the standard temperature (5C to 35C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. * Avoid locations where dust or harmful gases are present and avoid direct sunlight. * Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Electrostatic Discharge * When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 M of resistance to ground to prevent shock hazard. * Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. * When using measuring equipment such as a curve tracer, the equipment should be grounded. * When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. * The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil.
Soldering * When manually soldering the products, please be sure to minimize the working time, within the following limits: Soldering Iron Temperature (C) 38010 Time (s) 3 (once only)
*
Reflow soldering can be performed a maximum of twice, using the following recommended profile:
250 230 Temperature (C) 250C Maximum
180 150 90 30s Time 30 10s
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
10
SI-8008HD
DC-to-DC Step-Down Converter
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. The information included herein is believed to be accurate and reliable. Application and operation examples described in this document are given for reference only and Sanken assumes no responsibility for any infringement of industrial property right, intellectual property rights or any other rights of Sanken or any third party which may result from its use. When using the products herein, the applicability and suitability of such products for the intended purpose shall be the users responsibility to determine. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. Anti-radioactive ray design is not considered for the products listed herein.
Copyright (c) 2007 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSJ-03118
For the latest version of this document, visit our website: www.allegromicro.com
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
11
DC-to-DC Step-Down Converter
SI-8008HD

January, 2008
Asia Pacific
China
Sanken Electric Hong Kong Co., Ltd. Suite 1026 Ocean Centre, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: 852-2735-5262 Fax: 852-2735-5494 Sanken Electric (Shanghai) Co., Ltd. Room3202, Maxdo Centre, Xingyi Road 8, Changning district, Shanghai, China Tel: 86-21-5208-1177 Fax: 86-21-5208-1757 Taiwan Sanken Electric Co., Ltd. Room 1801, 18th Floor, 88 Jung Shiau East Road, Sec. 2, Taipei 100, Taiwan R.O.C. Tel: 886-2-2356-8161 Fax: 886-2-2356-8261
India
Saket Devices Pvt. Ltd. Office No.13, First Floor, Bandal - Dhankude Plaza, Near PMT Depot, Paud Road, Kothrud, Pune - 411 038, India Tel: 91-20-5621-2340 91-20-2528-5449 Fax: 91-20-2528-5459
Japan
Sanken Electric Co., Ltd. Overseas Sales Headquaters Metropolitan Plaza Bldg. 1-11-1 Nishi-Ikebukuro, Toshima-ku, Tokyo 171-0021, Japan Tel: 81-3-3986-6164 Fax: 81-3-3986-8637
Korea
Sanken Electric Korea Co., Ltd. Mirae Asset Life Bldg. 6F, 168 Kongduk-dong, Mapo-ku, Seoul, 121-705, Korea Tel: 82-2-714-3700 Fax: 82-2-3272-2145
Singapore
Sanken Electric Singapore Pte. Ltd. 150 Beach Road, #14-03 The Gateway West, Singapore 189720 Tel: 65-6291-4755 Fax: 65-6297-1744
Sanken Electric Co., Ltd.
I02-009EB-080130
DC-to-DC Step-Down Converter
SI-8008HD
Europe
United Kingdom
Sanken Power Systems (UK) Limited Pencoed Technology Park Pencoed, Bridgend CF35 5HY. UK Tel: 44-1656-869-100 Fax: 44-1656-869-162
January, 2008
North America
United States
Allegro MicroSystems, Inc. 115 Northeast Cutoff, Worcester, Massachusetts 01606, U.S.A. Tel: 1-508-853-5000 Fax: 1-508-853-3353 Allegro MicroSystems, Inc. (Southern California) 14 Hughes Street, Suite B105, Irvine, CA 92618 Tel: 1-949-460-2003 Fax: 1-949-460-7837
Sanken Electric Co., Ltd.
I02-009EB-080130

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